Come See TEKLYNX with Epson at PACK EXPO 2012

01 October 2012

PACK EXPO International 2012 is the one and only event with the most innovative technologies and solutions that drive your business.

PACK EXPO is October 28-31, 2012 at the McCormick Place in Chicago, IL.

TEKLYNX will be exhibiting TEKLYNX CENTRAL GHS with Epson’s TM-C3400 printer to promote our complete solution for GHS labeling. Visit us in booth #3957.

Click here to register for PACK EXPO 2012!